XC3S200-4TQG144C

xc3s200-4tqg144c, Spartan-3 FPGA, –0.5 to 1.32 V, ±100 mA, Xilinx, Inc

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Price:: US $2.30~2.50 / piece [Get Latest Price]

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101 ~ 500 :	2.40 / Piece
501 ~ 1000 :	2.30 / Piece

PartNumber:: XC3S200-4TQG144C

Brand:: Xilinx, Inc - Xilinx | Pack: | D/C:

Availability:: Supply Ability: 8000/Day Can Ship Immediately
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Products Upload time: 2013-08-18

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Part Number:XC3S200-4TQG144C
US $2.30 - 2.50
XC3S200-4TQG144C

US $4.85 - 6.85 / Piece
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Product Summary

The xc3s200-4tqg144c is a Spartan-3 FPGA. The xc3s200-4tqg144c is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family of the xc3s200-4tqg144c offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Table 1.

Parametrics

xc3s200-4tqg144c absolute maximum ratings: (1)VCCINT, Internal supply voltage relative to GND: –0.5 to 1.32 V; (2)VCCAUX, Auxiliary supply voltage relative to GND: –0.5 to 3.00 V; (3)VCCO, Output driver supply voltage relative to GND: –0.5 to 3.75 V; (4)VREF, Input reference voltage relative to GND: –0.5 to VCCO+0.5 V; (5)VIN, Voltage applied to all User I/O pins and Dual-Purpose pins relative to GND(2,4): -0.95 to 4.4 V; (6)IIK, Input clamp current per I/O pin: ±100 mA; (7)VESD, Electrostatic Discharge Voltage pins relative: ±2000 V; (8)TJ Junction temperature: 125 ℃; (9)TSOL Soldering temperature(4): 220 ℃; (10)TSTG Storage temperature: –65 to 150 ℃.

Features

xc3s200-4tqg144c features: (1)Low-cost, high-performance logic solution for high-volume consumer-oriented applications; (2)Densities up to 74,880 logic cells; (3)SelectIO interface signaling; (4)Up to 633 I/O pins; (5)622+ Mb/s data transfer rate per I/O; (6)18 single-ended signal standards; (9)8 differential I/O standards including LVDS, RSDS; (10)Termination by Digitally Controlled Impedance; (11)Signal swing ranging from 1.14V to 3.465V; (12)Double Data Rate (DDR) support; (13)DDR, DDR2 SDRAM support up to 333 Mb/s; (14)Logic resources; (14)Abundant logic cells with shift register capability; (16)Wide, fast multiplexers; (17)Fast look-ahead carry logic; (18)Dedicated 18 × 18 multipliers; (19)JTAG logic compatible with IEEE 1149.1/1532 ; (20)SelectRAM hierarchical memory; (21)Up to 520 Kbits of total distributed RAM; (22)Digital Clock Manager (up to four DCMs); (23)Clock skew elimination; (24)Frequency synthesis; (25)High resolution phase shifting; (26)Eight global clock lines and abundant routing; (27)Fully supported by Xilinx ISE and WebPACK software development systems; (28)MicroBlaze and PicoBlaze processor, PCI, PCI Express PIPE Endpoint, and other IP cores; (29)Pb-free packaging options; (30)Automotive Spartan-3 XA Family variant.